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GD25LX128J

Product brand :
GD;Category: Octa SPI (OPI) NOR Flash
Manufactory model :
GD25LX128J
Packaging specifications:
TFBGA24 5x5 ball array
Data Manual :
GD25LX128J Click to download
Packaging method :
Tape & Reel / Tube / Bulk/tray
Product Consulting :
Online message    QQ:

Product Description

1. Basic Overview The GD25LX128J is a GigaDevice mass-produced (MP) 128Mb (16MB) single 1.8V octal xSPI NOR Flash compliant with JEDEC xSPI standards. It features high-speed XIP (execute-in-place) for code execution and targets high-bandwidth, high-performance embedded applications such as automotive, 5G base stations, and industrial systems. 2. Core Power Supply & Interface Single-voltage architecture: VCC 1.65–2.0V (typical 1.8V), shared by core and I/O with no independent 1.2V VIO pin, compatible with 1.8V I/O hosts. Differs from dual-voltage GD25NX128J. Octal high-speed bus: Supports 1/2/4/8-line SPI, STR/DTR double data rate, up to 200MHz clock, and 400MB/s peak bandwidth in 8-line DTR mode. Built-in DQS synchronization strobe ensures stable high-speed signal timing. 3. Storage Performance Page size: 256B, typical page program time: 0.12ms. Uniform 4KB sectors with typical sector erase time of 27ms; supports erase suspend/resume. Endurance: ≥100K erase/program cycles, 20-year data retention at room temperature. Integrated hardware ECC and CRC for reliable high-speed R/W. 4. Security & Protection Hardware RESET# and WP# write protection; power-on write lock prevents misuse. 3 OTP (one-time programmable) security registers, 64-bit globally unique UID for key/device ID storage, and multi-level software block locks for firmware protection. 5. Package & Temperature Packages (identical to GD25NX128J, differentiated only by markings): - TFBGA24 8×6mm (5×5 ball array, mainstream production) - WLCSP 4×6 ultra-thin wafer-level packaging for compact modules. Temperature grades: - Commercial: -40℃ to +85℃ - Industrial: -40℃ to +105℃ - Automotive AEC-Q100 Grade1: -40℃ to +125℃ (suited for high-temp automotive use). 6. Typical Applications Automotive smart cockpits, autonomous driving domain controllers, 5G base stations, industrial high-end controllers, AI computing boards, high-speed firmware update devices, and premium medical equipment—ideal for systems requiring large bandwidth and fast code execution. 7. Key Comparisons Same-capacity GD25NX128J adopts dual-voltage (1.8V core + 1.2V I/O) for next-gen low-power 1.2V SoCs. GD25LX128J’s single 1.8V design suits traditional 1.8V I/O high-performance platforms. Both share identical commands, packages, and speeds, differing only in power circuit design.


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