Core Parameters Core: ARM Cortex‑M3 (32-bit, Thumb‑2 ISA) GigaDevice GD32 MCU Frequency: Up to 120MHz, zero-wait Flash access GigaDevice GD32 MCU Memory: 256KB Flash, 128KB SRAM GigaDevice Package: LQFP‑64 (10×10mm, 0.5mm pitch) I/O: Up to 51, 5V-tolerant GigaDevice Voltage: 2.6V–3.6V (Core 1.2V) Temperature: ‑40℃ ~ +85℃ GigaDevice Main Peripherals Analog: 3×12-bit ADC (2MSPS, 16 ch), 2×12-bit DAC GigaDevice Timers: 10×16-bit general-purpose, 2×advanced PWM, 2×basic, 1×24-bit SysTick GigaDevice Communication: 4×USART + 2×UART 4×I2C, 3×SPI, 2×I2S 2×CAN 2.0B, 1×USB 2.0 FS OTG, 1×SDIO GigaDevice System: RTC, 2×watchdog (independent + window), DMA, NVIC GigaDevice Key Features High Performance: 120MHz Cortex‑M3, single-cycle multiply/divide, fast interrupt response GigaDevice GD32 MCU. Low Power: Multiple modes (sleep/stop/standby), ideal for battery-powered devices GigaDevice GD32 MCU. High Integration: Rich peripherals reduce external components, simplifying design GigaDevice GD32 MCU. High Reliability: Wide voltage/temperature range, 5V-tolerant I/O, strong noise immunity. Typical Applications Industrial automation (PLC, sensor control) HMI (touchscreen controllers) Motor control (inverters, servo drives) Smart home (appliance control, gateways) IoT devices (data acquisition, wireless nodes) Model Decoding GD32: GigaDevice MCU series prefix F205: F2 series, performance variant R: LQFP package C: 256KB Flash T: Temperature range ‑40℃~+85℃ 6: 64-pin GigaDevice