GD32C231K8T6
- Manufactory model :
- GD32C231K8T6
- Packaging specifications:
- LQFP32
- Data Manual :
-
GD32C231K8T6 Click to download
- Packaging method :
- Tape & Reel / Tube / Bulk
- Product Consulting :
- Online message QQ:
Product Description
GD32C231K8T6 (GigaDevice, Cortex‑M23 Entry-Level MCU) Key Highlights: 48MHz Cortex‑M23, 64KB Flash/12KB SRAM (with ECC), LQFP32, Wide Voltage 1.8–5.5V, Industrial Grade ‑40℃~105℃ GigaDevice. I. Basic Information Model: GD32C231K8T6 Core: Arm Cortex‑M23 (48MHz, ~20% faster than M0+) GigaDevice Package: LQFP32 (32 pins, 7×7mm) GigaDevice Memory: 64KB Flash + 12KB SRAM (Full ECC Correction) GigaDevice Operating Voltage: 1.8V–5.5V (Compatible with 3.3V/5V Systems) Temperature Range: ‑40℃ ~ +105℃ (Industrial Grade) Power Consumption: ~5μA in Deep Sleep, 2.6μs Wake-up Time II. Peripheral Resources Timers: 4×16-bit General-Purpose Timers + 1×16-bit Advanced Timer GigaDevice Communication Interfaces: 3×UART (Including 1×USART) GigaDevice 2×I2C (Supports 1Mbps Fast Mode+) GigaDevice 2×SPI (Up to 24Mbps, Supports QSPI) GigaDevice 1×I2S GigaDevice Analog: 1×12-bit ADC (12 Channels), 2× Comparators GigaDevice System: 2× Watchdogs (Independent + Window), RTC, Hardware CRC III. Typical Applications Small Appliances, BMS Battery Management, Industrial Auxiliary Control Handheld Devices, Low-Power Sensor Terminals, Automotive Aftermarket IV. Model Naming Convention GD32: GigaDevice MCU Series C231: Cortex‑M23 Core, C231 Sub-Series K: LQFP32 Package 8: 64KB Flash T6: Temperature ‑40℃~105℃, Tape&Reel Packing V. Replacement & Compatibility Can Replace STM32F030K6T6, STM32L051K8T6, etc. Pin/Peripheral Highly Compatible, Low Migration Cost
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