The GD55X02GE is a 2Gb (256MB) octal SPI NOR Flash from GigaDevice, automotive-grade, high-performance, in TFBGA24 package.

1. Key Parameters Capacity: 2Gb (256MB) Type: SPI NOR Flash (Octal SPI/xSPI) Voltage: 2.7V–3.6V (3V nominal) Interface: Single I/O, OPI, DTR; x8 Octal Channel Frequency: 166MHz (x1/x8); 200MHz (x8 DTR) Throughput: Up to 400MB/s (x8 DTR) Package: TFBGA24 (8×6mm, 5×5 Ball Array) Temperature: -40℃～105℃ /-40℃～125℃ (Automotive AEC‑Q100 Grade 1) Status: MP (Mass Production) GigaDevice

ECC hardware error correction + CRC checksum for enhanced reliability DTR (Double Transfer Rate) + DQS data strobe Hardware reset (H/W RESET), write protection (WP#) Security register (OTP lock), unique ID (Unique ID) Supports Execute-In-Place (XIP) with low RAM dependency 100,000 program/erase cycles, 20-year data retention - GigaDevice

III. Typical Applications Automotive Electronics: ADAS, Smart Cockpit, Domain Controller Industrial Control, 5G Base Stations, AI/ML Equipment High-Performance Firmware Storage, High-Speed Code Execution – GigaDevice IV. Model Interpretation (GD55X02GE) GD55: Series (High-Speed Octal SPI NOR) X: 3V Voltage, xSPI/OPI Interface 02: 2Gb Capacity G: Temperature (-40℃ to 125℃) E: TFBGA24 Package V. Alternative/Compatible Models GD55LT02GE: 1.8V, 2Gb, TFBGA24 GD25X02GE: Same Capacity & Package, Industrial-Grade Temperature