GD55B02GF is GigaDevice’s 2Gb (256MB), 3V, Quad SPI (4-channel) NOR Flash, belonging to the GD55B high-performance automotive/industrial-grade series, featuring large capacity, high reliability, and high-speed XIP (execute-in-place).

1. Key Parameters (Overview) Capacity: 2Gb (256MB) Voltage: 3.0V (2.7–3.6V) Interface: Quad SPI (4I/O), compatible with 1/2/4 channels Clock Frequency: 133MHz (x1/x4); 90MHz (x4 DTR) Package: TFBGA24 (5×5 ball array, 8×6mm) Temperature Grade: Industrial: -40℃ ~ +105℃ Automotive: -40℃ ~ +125℃ (AEC-Q100 Grade 1) Process: 55nm Status: Mass Production (MP) 2. Key Features High-Speed Read/Write Supports DTR (Double Transfer Rate), x4 mode throughput up to 45MB/s. Default 4I/O high-speed mode, compatible with XIP for direct code execution. High Reliability ECC/CRC hardware verification for enhanced data integrity. 100,000 erase/write cycles, 20-year data retention. H/W RESET, WP# write protection, Secured OTP (One-Time Programmable). Automotive & Safety ISO 26262 ASIL D functional safety certified. Compliant with AEC-Q100 Grade 1 (-40℃~125℃). Low Power Consumption Standby current <10μA, suitable for battery-powered devices. 3. Typical Applications Automotive Electronics: In-vehicle navigation, ADAS, dashboards, body control modules (BCM). Industrial Control: PLCs, servo drives, industrial robots, HMIs. Networking: 5G small cells, routers, switches. AIoT / Embedded: High-end IoT devices requiring large-capacity code storage and high-speed XIP. 4. Model Suffix Explanation GD55B02GF: B = 4-channel high-performance series 02 = 2Gb G = TFBGA24 package F = Temperature grade (-40℃~125℃) 5. Alternative / Compatible Models GD55F02GF: 166MHz higher-frequency variant. GD55B02GE: Same capacity and package, different temperature/features. W25Q256JV: Winbond 256Mb SPI NOR (Industrial grade).